The LDS-method uses special plastic materials with additives. After a partial activation by laser conductor layers are created in a chemical reaction. NORWE has further developed this technology by using cross-linked plastic materials to allow winding on the plastic without solder-pins.
The advantages are convincing – downsized components, simplified connecting technology, lower weight, optimal coplanarity as well as the possibility to provide smaller and medium-sized series without expenses for a pinning technique.
NORWE uses this method amongst others for SMD-components of the SMD3-series and already for solutions to customers’ specifications. Our specialists will be glad to answer your questions.
The NORWE LDS-process
The components to be laser structured are produced by injection moulding. NORWE uses a plastic material doped with additives which has specially been developed for laser structuring and cross-linking. This technology allows the use of high temperatures during the soldering process.
The plastic components are activated with a laser beam. This process induces a chemical reaction at which the metal particles that track form the nuclei for the subsequent metallization. In addition to the activation the laser creates a micro-roughened surface in which the copper is firmly anchored during the metallization. There are practically no limits regarding the width or tracking of metallized surfaces – even three-dimensional designs, like for the SMD3- coilformers, are possible.
The metallization of the components takes place in current-free copper baths. The desired thickness of the copper layer can be influenced by changing the exposure time in the baths. The copper is coated with a nickel layer. A thin gold finish is created, to ensure best solder properties.
The finished components are compatible with conventional winding and soldering processes, as due to the plastic material used they withstand short-term temperatures of 450–500°C. The gold finish ensures short solder times in the tin bath. Moreover the coilformers which are mostly SMD-components are reflow solderable without any restrictions.